CD00253742 Datasheet, PDF (112/120 Pages) STMicroelectronics – XL-density performance line ARM-based 32-bit MCU

Package characteristics
STM32F103xF, STM32F103xG
Figure 64. LQFP100, 14 x 14 mm 100-pin low-profile
quad flat package outline⁽¹⁾
75
76
D
D1
D3
51
50
0.25 mm
0.10 inch
GAGE PLANE
k
L
L1
C
b
E3 E1 E
Figure 65. Recommended footprint⁽¹⁾⁽²⁾
75
76
16.7 14.3
51
50
0.5
0.3
100
Pin 1
1
identification
26
25
e
1. Drawing is not to scale.
2. Dimensions are in millimeters.
SEATING PLANE _C
ccc C
A1
A2
A
1L_ME
100
26
1.2
1
25
12.3
16.7
ai14906b
Table 70.
Symbol
LQPF100 – 14 x 14 mm 100-pin low-profile quad flat package mechanical data
millimeters
inches⁽¹⁾
Min
Typ
Max
Min
Typ
Max
A
1.60
0.063
A1
0.05
0.15
0.002
0.0059
A2
1.35
1.40
1.45
0.0531
0.0551
0.0571
b
0.17
0.22
0.27
0.0067
0.0087
0.0106
c
0.09
0.20
0.0035
0.0079
D
15.80
16.00
16.20
0.622
0.6299
0.6378
D1
13.80
14.00
14.20
0.5433
0.5512
0.5591
D3
12.00
0.4724
E
15.80
16.00
16.20
0.622
0.6299
0.6378
E1
13.80
14.00
14.20
0.5433
0.5512
0.5591
E3
12.00
0.4724
e
0.50
0.0197
L
0.45
0.60
0.75
0.0177
0.0236
0.0295
L1
1.00
0.0394
k
0°
3.5°
7°
0°
3.5°
7°
ccc
0.08
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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Doc ID 16554 Rev 3