CD00191174 Datasheet, PDF (11/112 Pages) STMicroelectronics – High-density access line, ARM-based 32-bit MCU

STM32F101xC, STM32F101xD, STM32F101xE
Description
2.1
Device overview
The STM32F101xx high-density access line family offers devices in 3 different package
types: from 64 pins to 144 pins. Depending on the device chosen, different sets of
peripherals are included, the description below gives an overview of the complete range of
peripherals proposed in this family.
●
Figure 1 shows the general block diagram of the device family.
Table 2.
STM32F101xC, STM32F101xD and STM32F101xE features and peripheral
counts
Peripherals
STM32F101Rx
STM32F101Vx
STM32F101Zx
Flash memory in Kbytes 256 384 512 256 384 512 256 384 512
SRAM in Kbytes
FSMC
Timers
General-
purpose
Basic
SPI
Comm
I²C
32
48
No
32
48
Yes⁽¹⁾
4
2
3
2
32
48
Yes
USART
GPIOs
51
12-bit ADC
1
Number of channels
16
12-bit DAC
Number of channels
5
80
112
1
1
16
16
1
2
CPU frequency
Operating voltage
Operating temperatures
Package
36 MHz
2.0 to 3.6 V
Ambient temperature: –40 to +85 °C (see Table 10)
Junction temperature: –40 to +105 °C (see Table 10)
LQFP64
LQFP100
LQFP144
1. For the LQFP100 package, only FSMC Bank1 and Bank2 are available. Bank1 can only support a
multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit
NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not
available in this package.
Doc ID 14610 Rev 8
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