CD00191174 Datasheet, PDF (102/112 Pages) STMicroelectronics – High-density access line, ARM-based 32-bit MCU

Package characteristics
STM32F101xC, STM32F101xD, STM32F101xE
Figure 56. LQFP100 – 14 x 14 mm, 100-pin low-profile Figure 57. Recommended footprint⁽¹⁾⁽²⁾
quad flat package outline⁽¹⁾
75
76
D
D1
D3
51
50
0.25 mm
0.10 inch
GAGE PLANE
k
L
L1
C
75
76
16.7 14.3
51
50
0.5
0.3
b
E3 E1 E
100
Pin 1
1
identification
26
25
e
1. Drawing is not to scale.
2. Dimensions are in millimeters.
SEATING PLANE _C
ccc C
A1
A2
A
1L_ME
100
26
1.2
1
25
12.3
16.7
ai14906b
Table 62.
Symbol
LQPF100 – 14 x 14 mm, 100-pin low-profile quad flat package mechanical data
millimeters
inches⁽¹⁾
Min
Typ
Max
Min
Typ
Max
A
1.600
0.0630
A1
0.050
0.150
0.0020
0.0059
A2
1.350
1.400
1.450
0.0531
0.0551
0.0571
b
0.170
0.220
0.270
0.0067
0.0087
0.0106
c
0.090
0.200
0.0035
0.0079
D
15.800
16.000
16.200
0.622
0.6299
0.6378
D1
13.800
14.000
14.200
0.5433
0.5512
0.5591
D3
12.000
0.4724
E
15.800
16.000
16.200
0.622
0.6299
0.6378
E1
13.800
14.000
14.200
0.5433
0.5512
0.5591
E3
12.000
0.4724
e
0.500
0.0197
L
0.450
0.600
0.750
0.0177
0.0236
0.0295
L1
1.000
0.0394
k
0°
3.5°
7°
0°
3.5°
7°
ccc
0.08
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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Doc ID 14610 Rev 8