CD00191174 Datasheet, PDF (101/112 Pages) STMicroelectronics – High-density access line, ARM-based 32-bit MCU

STM32F101xC, STM32F101xD, STM32F101xE
Package characteristics
Figure 54. LQFP144, 20 x 20 mm, 144-pin thin quad flat
package outline⁽¹⁾
Seating plane
C
Figure 55. Recommended
footprint⁽¹⁾⁽²⁾
A A2 A1
b
ccc C
D
D1
D3
108
109
c
73
72
0.25 mm
gage plane
k
108
109
0.35
A1
L
0.5
L1
73 ^1.35
72
17.85
19.9
22.6
E1 E
E3
144
1
19.9
22.6
144
Pin 1
1
identification
37
36
e
1. Drawing is not to scale.
2. Dimensions are in millimeters.
ME_1A
Table 61.
Symbol
LQFP144, 20 x 20 mm, 144-pin thin quad flat package mechanical data
millimeters
inches⁽¹⁾
Min
Typ
Max
Min
Typ
A
1.60
A1
0.050
0.15
0.0020
A2
1.350
1.400
1.45
0.0531
0.0551
b
0.170
0.220
0.27
0.0067
0.0087
c
0.090
0.20
0.0035
D
21.800
22.000
22.20
0.8583
0.8661
D1
19.800
20.000
20.20
0.7795
0.7874
D3
17.500
0.689
E
21.800
22.000
22.20
0.8583
0.8661
E1
19.800
20.000
20.20
0.7795
0.7874
E3
17.500
0.689
e
0.500
0.0197
L
0.450
0.600
0.75
0.0177
0.0236
L1
1.000
0.0394
k
0°
3.5°
7°
0°
3.5°
ccc
0.080
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
37
36
ai149
Max
0.0630
0.0059
0.0571
0.0106
0.0079
0.874
0.7953
0.874
0.7953
0.0295
7°
Doc ID 14610 Rev 8
101/112