CD00191174 Datasheet, PDF (100/112 Pages) STMicroelectronics – High-density access line, ARM-based 32-bit MCU

Package characteristics
STM32F101xC, STM32F101xD, STM32F101xE
6
Package characteristics
6.1
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
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Doc ID 14610 Rev 8