91C94 Datasheet, PDF (116/120 Pages) SMSC Corporation – ISA/PCMCIA SINGLE CHIP ETHERNET CONTROLLER WITH RAM

D
D1
E
E1
e
W
A
A2
H
0.10
-C -
A1
TD/TE
0
L
L1
D IM
A
A1
A2
D
D1
E
E1
H
L
L1
e
0
W
TD(1 )
TE(1)
TD(2 )
TE(2)
Millimete rs
MIN
2.80
0. 1
2.57
23. 4
19. 9
17. 4
13. 9
MAX
3.15
0.45
2.87
24.15
20. 1
18.15
14. 1
0. 1
0. 2
0.65
0.95
1. 8
2. 6
0.65 BSC
0°
1 2°
.2
.4
21. 8
22. 2
15. 8
16. 2
22.21
22.76
16.27
16.82
I nch es
MIN
. 11 0
. 00 4
. 10 1
. 92 1
. 78 3
. 68 5
. 54 7
MAX
. 12 4
. 01 8
. 11 3
. 95 1
. 79 1
. 71 5
. 55 5
. 00 4
. 00 8
. 02 6
. 03 7
. 07 1
. 10 2
.0256 BSC
0°
1 2°
. 00 8
. 01 6
. 85 8
. 87 4
. 62 2
. 63 8
. 87 4
. 89 6
. 64 1
. 66 2
No te s:
1) Coplana rit y is 0 .100mm (.004 ") maximum.
2) Toler ance on t he pos ition of the lead s is
0.200mm (.008") maximum.
3) Package bod y dimen sions D1 and E1 do not
inc lude the mold pr otrusion. Max imum mold
pro tr usion is 0.2 5mm (.010").
4) D imensions T D a nd TE are impor tant for t est ing
by robot ic h andler. O nly a bo ve combinations of (1)
or (2) ar e ac ceptable.
5) C on tr olling dimension: mil limeter. Dimensions
ini nches for reference only and not necessarily
acc urate .
FIGURE 44 - 100 PIN QFP PACKAGE OUTLINE
116