SH3100 Datasheet, PDF (79/80 Pages) Semtech Corporation – Supervisory IC with I2C Interface and PWM

SH3100
POWER MANAGEMENT
Outline Drawing - MLP 3 x 3 mm 16 pins
A
E E1
e
D1
B
D
BOTTOM VIEW
A
aaa C
SIDE VIEW
SEE DETAIL A
PIN 1
EXPOSED
PAD
SEE DETAIL B
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A .031 ^- .040 0.80 ^- 1.00
A1 .000 ^- .002 0.00 ^- 0.05
A2 - (.008) -
- (0.20) -
D .114 .118 .122 2.90 3.00 3.10
D1 .055 .061 .065 1.40 1.55 1.65
E .114 .118 .122 2.90 3.00 3.10
E1 .055 .061 .065 1.40 1.55 1.65
L .012 .014 .016 0.30 0.35 0.40
L1 -
- .004 -
- 0.10
b .007 .009 .012 0.18 0.23 0.30
N
16
16
e
.020 BSC
0.50 BSC
k .008 -
- 0.20 -
-
R
.004
0.09
T - .006 -
- 0.15 -
aaa
.003
0.08
bbb
.004
0.10
bxN
bbb C A B
8X 0.27
L
A2
kxN
A1
C
0.4
DETAIL B
NOTES:
T
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS
(ANGLES IN DEGREES).
2. DIMENSION "L1" REPRESENTS TERMINAL PULL BACK
FROM PACKAGE EDGE. WHERE TERMINAL PULL BACK EXITS,
ONLY UPPER HALF OF LEAD IS VISIBLE ON PACKAGE EDGE
DUE TO HALF ETCHING OF LEADFRAME.
3. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS
THE TERMINALS.
8X 0.15
R TYP
L1
0.4
DETAIL A
Land Pattern - MLP 3 x 3 mm 16 pins
© 2006 Semtech Corp.
R
H
(C) _K
X
GZ
Y
P
DIM
C
G
H
K
R
P
X
Y
Z
DIMENSIONS
INCHES MILLIMETERS
(.108)
(2.75)
.083
2.10
.065
1.65
.065
1.65
.005
0.12
.020
0.50
.010
0.25
.026
0.65
.134
3.40
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2. ^{DO NOT PLACE VIAS BETWEEN THE CORNER LEADS INSIDE THE}
3X3MM PACKAGE FOOTPRINT.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
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