K4R271669A Datasheet, PDF (60/64 Pages) Samsung semiconductor – 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM

K4R271669A/K4R441869A
Center-Bonded uBGA Package
Figure 61 shows the form and dimensions of the recom-
mended package for the center-bonded CSP device class.
D
ABCDE FGH J
12
11
10
9
8
7
6
5
4
3
2
1
E1
d e1
Bottom
A
e2
E
Direct RDRAM^™
Top
Bottom
Figure 61: Center-Bonded uBGA Package
Bottom
Table 27 lists the numerical values corresponding to dimen-
sions shown in Figure 61.
Table 27: Center-Bonded uBGA Package Dimensions
Symbol
Parameter
e1
Ball pitch (x-axis)
e2
Ball pitch (y-axis)
A
Package body length
D
Package body width
E
Package total thickness
E1
Ball height
d
Ball diameter
Min(128Mb/144Mb) Max(128Mb/144Mb)
Unit
1.00
0.80
11.90
10.10
-
0.20
0.30
1.00
mm
0.80
mm
12.10
mm
10.30
mm
1.00^a
mm
0.30
mm
0.40
mm
a. The E,MAX parameter for SO-RIMM applications is 0.94mm.
Page 58
Rev. 1.02 Jan. 2000