K4R271669A Datasheet, PDF (4/64 Pages) Samsung semiconductor – 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM

K4R271669A/K4R441869A
Direct RDRAM^™
Pinouts and Definitions
Normal Package
This table shows the pin assignments of the normal RDRAM package.
Table 1 : a. Center-Bonded Device(Top View For Normal Package)
12
GND
11
10
DQA7
9
GND
8
CMD
7
6
5
SCK
4
VCMOS
3
DQA8^*
2
1
GND
A
ROW
COL
DQA4
VDD
DQA5
DQA6
GND
DQA3
B
VDD
CFM CFMN
GND GNDa
DQA2 VDDa
DQA1 VREF
VDD
GND
DQA0 CTMN
VDD
C
D
RQ5
VDD
RQ6
RQ7
GND
CTM
E
VDD
GND
RQ3
GND
RQ2
DQB0
VDD
DQB1
DQB4
VDD
DQB5
DQB7
GND
SIO1
RQ1
VDD
RQ4
DQB2
GND
RQ0
DQB6
GND
DQB3
SIO0
VCMOS
DQB8^*
VDD
GND
F
G
H
J
b. Top marking example of normal package
SAMSUNG 001
K4Rxxxx69A-Nxxx
For normal package, pin #1(ROW 1, COL A) is
located at the A1 position on the top side and
the A1 position is marked by the marker “ “.
Top View
Mirrored Package
Chip
This table shows the pin assignments of the mirrored RDRAM package.
Table 2: a.Center-Bonded Device(Top View For Mirrored Package)
12
GND
VDD
VDD
GND
* DQA8/DQB8 are just used for
144Mb RDRAM. These two pins are
NC(No Connection) in 128Mb RDRAM.
11
10
DQA8^*
DQA3 DQA0 CTMN
CTM
RQ4
RQ0 DQB3 DQB8^* _{b. Top marking example of mirrored package}
9
VCMOS GND
VDD
GND
GND
VDD
GND
GND VCMOS
8
SCK
DQA6 DQA1 VREF
RQ7
RQ1
DQB2 DQB6
SIO0
7
6
SAMSUNG 001
K4Rxxxx69A-Mxxx
5
CMD
DQA5 DQA2 VDDa
RQ6
RQ2
DQB1 DQB5
SIO1
4
GND
VDD
GND GNDa VDD
GND
VDD
VDD
GND
M
3
DQA7
DQA4
CFM
CFMN
RQ5
RQ3
DQB0 DQB4
DQB7
2
1
GND
VDD
VDD
GND
For mirrored package, pin #1(ROW 1, COL A)
is located at the A1 postion on the top side and
ROW
A
B
C
D
E
F
G
H
J
the A1 position is marked by the alphabet “M“.
COL
Page 2
Rev. 1.02 Jan. 2000