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K4R271669A Datasheet, PDF (57/64 Pages) Samsung semiconductor – 256K x 16/18 bit x 2*16 Dependent Banks Direct RDRAMTM
K4R271669A/K4R441869A
Direct RDRAM™
Absolute Maximum Ratings
Table 23: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
VI,ABS
VDD,ABS, VDDA,ABS
TSTORE
Voltage applied to any RSL or CMOS pin with respect to Gnd
Voltage on VDD and VDDA with respect to Gnd
Storage temperature
- 0.3
VDD+0.3
V
- 0.5
VDD+1.0
V
- 50
100
°C
IDD - Supply Current Profile
Table 24: Supply Current Profile
IDD value RDRAM blocks consuming powera
IDD,PDN
IDD,NAP
IDD,STBY
IDD,ATTN
IDD,ATTN-W
IDD,ATTN-R
Self-refresh only for INIT.LSR=0
T/RCLK-Nap
T/RCLK, ROW-demux
T/RCLK, ROW-demux, COL-demux
T/RCLK, ROW-demux,COL-demux,DQ-demux,1•WR-SenseAmp,
4•ACT-Bank
T/RCLK, ROW-demux,COL-demux,DQ-mux,1•RD-SenseAmp,
4•ACT-Bank c
Max
-45
-800
3000
4
105
165
575/625b
490/520
Max
-45
-711
3000
4
100
155
525/580
450/480
Max
-53.3
-600
3000
4
90
140
455/500
Unit
µA
mA
mA
mA
mA
400/420
mA
a. The CMOS interface consumes power in all power states.
b. x16/x18 RDRAM data width
c. This does not include the IOL sink current. The RDRAM dissipates IOL•VOL in each output driver when a logic one is driven.
Page 55
Rev. 1.02 Jan. 2000