S3C24A0A Datasheet, PDF (106/519 Pages) Samsung semiconductor – 32-BIT RISC MICROPROCESSOR

SDRAM CONTROLLER
S3C24A0A RISC MICROPROCESSOR (Preliminary Spec)
SDRAM CONFIGURATION REGISTER
Register
Address
SDRAM_BANKCFG 0x40C40000
R/W
Description
R/W Port 1 SDRAM configuration register
Reset Value
0x9f0c
SDRAM_BANKCFG
DS
TCSR
PASR
Reserved
PWRDN
Tras
Trc
Trcd
Trp
DENSITY1
DENSITY0
Bit
[30:29]
[28:27]
[26:24]
[23:21]
[20]
[19:16]
[15:12]
[11:10]
[9:8]
[7:6]
[5:4]
Description
Driver Strength Control
00 = Full
01 = Half
10 = Weak
11 = RFU
Note: DS bit fields are only for mobile SDRAM.
Temperature compensated self refresh control
00 = 46 ~ 70 °C
01 = 16 ~ 45 °C
10 = –25 ~ 15 °C
11 = 71 ~ 85 °C
Note: TCSR bit fields are only for mobile SDRAM.
Partial array self refresh control
000 = 4banks 001 = 2banks
011 = Reserved 100 = Reserved
110 = Reserved 111 = Reserved
010 = 1banks
101 = Reserved
Note: PASR bit fields are only for mobile SDRAM.
Reserved
0 = Not support SDRAM power down control
1 = Support SDRAM power down control
Row active time
0000=1-clock 0001=2-clock 0010=3-clock
0100=5-clock 0101=6-clock 0110=7-clock
1000=9-clock 1001=10-clock 1010=11-clock
1100=13-clock 1101=14-clock 1110=15-clock
0011=4-clock
0111=8-clock
1011=12-clock
1111=16-clock
Row cycle time
0000=1-clock 0001=2-clock
0100=5-clock 0101=6-clock
1000=9-clock 1001=10-clock
1100=13-clock 1101=14-clock
0010=3-clock
0110=7-clock
1010=11-clock
1110=15-clock
0011=4-clock
0111=8-clock
1011=12-clock
1111=16-clock
RAS to CAS delay
00 = 1-clock 01 = 2-clock 10 = 3-clock 11 = 4-clock
Row pre-charge time
00 = 1-clock 01 = 2-clock 10 = 3-clock 11 = 4-clock
SDRAM base component density of bank 1
00 = 16Mbit 01 = 64Mbit
10 = 128Mbit 11 = 256Mbit and 512Mbit
SDRAM base component density of bank 0
00 = 16Mbit 01 = 64Mbit
10 = 128Mbit 11 = 256Mbit and 512Mbit
Initial State
00b
00b
00b
0
1001b
1001b
11b
11b
00b
00b
3-6
Preliminary product information describe products that are in development,
for which full characterization data and associated errata are not yet available.
Specifications and information herein are subject to change without notice.