XPC850ZT50BU Datasheet, PDF (9/76 Pages) Motorola, Inc – Communications Controller Hardware Specifications

Part IV Thermal Characteristics
Table 4-3 shows the thermal characteristics for the MPC850.
Table 4-3. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal resistance for BGA ¹
θ _JA
40 ²
°C/W
θ _JA
31 ³
°C/W
θ _JA
24 ⁴
°C/W
Thermal Resistance for BGA (junction-to-case)
θ_JC
8
°C/W
1 _{For more information on the design of thermal vias on multilayer boards and BGA layout considerations in}
general, refer to AN-1231/D, Plastic Ball Grid Array Application Note available from your local Motorola sales
office.
2 _{Assumes natural convection and a single layer board (no thermal vias).}
3 _{Assumes natural convection, a multilayer board with thermal vias}4_{, 1 watt MPC850 dissipation, and a board}
temperature rise of 20°C above ambient.
4 _{Assumes natural convection, a multilayer board with thermal vias}4_{, 1 watt MPC850 dissipation, and a board}
temperature rise of 13°C above ambient.
• ^TJ ^{= T}A ^{+ (P}D ^θJA⁾
• ^PD ^{= (V}DD ^IDD^{) + P}I/O
where:
P_I/O is the power dissipation on pins
Table 4-4 provides power dissipation information.
Table 4-4. Power Dissipation (P_D)
Characteristic
Frequency (MHz) Typical ¹ Maximum ² Unit
Power Dissipation
All Revisions
(1:1) Mode
33
TBD
40
TBD
50
TBD
1 _{Typical power dissipation is measured at 3.3V}
2 _{Maximum power dissipation is measured at 3.65 V}
515
mW
590
mW
725
mW
Table 4-5 provides the DC electrical characteristics for the MPC850.
Table 4-5. DC Electrical Specifications
Characteristic
Symbol
Operating voltage at 40 MHz or less
VDDH, VDDL,
KAPWR, VDDSYN
Operating voltage at 40 MHz or higher
VDDH, VDDL,
KAPWR, VDDSYN
Input high voltage (address bus, data bus, EXTAL, EXTCLK,
VIH
and all bus control/status signals)
Input high voltage (all general purpose I/O and peripheral pins)
VIH
Min
3.0
3.135
2.0
2.0
Max Unit
3.6
V
3.465
V
3.6
V
5.5
V
MOTOROLA
MPC850 (Rev. A/B/C) Hardware Specifications
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