XPC850ZT50BU Datasheet, PDF (10/76 Pages) Motorola, Inc – Communications Controller Hardware Specifications

Table 4-5. DC Electrical Specifications (continued)
Characteristic
Symbol
Min
Max Unit
Input low voltage
VIL
GND
0.8
V
EXTAL, EXTCLK input high voltage
VIHC
0.7*(VCC) VCC+0.3 V
Input leakage current, Vin = 5.5 V (Except TMS, TRST, DSCK
I_in
and DSDI pins)
—
100
µA
Input leakage current, Vin = 3.6V (Except TMS, TRST, DSCK
I_In
and DSDI pins)
—
10
µA
Input leakage current, Vin = 0V (Except TMS, TRST, DSCK and
I_In
DSDI pins)
—
10
µA
Input capacitance
Output high voltage, IOH = -2.0 mA, VDDH = 3.0V
except XTAL, XFC, and open-drain pins
C_in
VOH
—
20
pF
2.4
—
V
Output low voltage
IOL = 2.0 mA CLKOUT
IOL = 3.2 mA ¹
IOL = 5.3 mA ²
IOL = 7.0 mA PA[14]/USBOE, PA[12]/TXD2
IOL = 8.9 mA TS, TA, TEA, BI, BB, HRESET, SRESET
VOL
—
0.5
V
1 _{A[6:31], TSIZ0/REG, TSIZ1, D[0:31], DP[0:3]/IRQ[3:6], RD/WR, BURST, RSV/IRQ2, IP_B[0:1]/IWP[0:1]/VFLS[0:1],}
IP_B2/IOIS16_B/AT2, IP_B3/IWP2/VF2, IP_B4/LWP0/VF0, IP_B5/LWP1/VF1, IP_B6/DSDI/AT0, IP_B7/PTR/AT3,
PA[15]/USBRXD, PA[13]/RXD2, PA[9]/L1TXDA/SMRXD2, PA[8]/L1RXDA/SMTXD2,
PA[7]/CLK1/TIN1/L1RCLKA/BRGO1, PA[6]/CLK2/TOUT1/TIN3, PA[5]/CLK3/TIN2/L1TCLKA/BRGO2,
PA[4]/CLK4/TOUT2/TIN4, PB[31]/SPISEL, PB[30]/SPICLK/TXD3, PB[29]/SPIMOSI /RXD3,
PB[28]/SPIMISO/BRGO3, PB[27]/I2CSDA/BRGO1, PB[26]/I2CSCL/BRGO2, PB[25]/SMTXD1/TXD3,
PB[24]/SMRXD1/RXD3, PB[23]/SMSYN1/SDACK1, PB[22]/SMSYN2/SDACK2, PB[19]/L1ST1,
PB[18]/RTS2/L1ST2, PB[17]/L1ST3, PB[16]/L1RQa/L1ST4, PC[15]/DREQ0/L1ST5, PC[14]/DREQ1/RTS2/L1ST6,
PC[13]/L1ST7/RTS3, PC[12]/L1RQa/L1ST8, PC[11]/USBRXP, PC[10]/TGATE1/USBRXN, PC[9]/CTS2,
PC[8]/CD2/TGATE1, PC[7]/USBTXP, PC[6]/USBTXN, PC[5]/CTS3/L1TSYNCA/SDACK1, PC[4]/CD3/L1RSYNCA,
PD[15], PD[14], PD[13], PD[12], PD[11], PD[10], PD[9], PD[8], PD[7], PD[6], PD[5], PD[4], PD[3]
2 _{BDIP/GPL_B5, BR, BG, FRZ/IRQ6, CS[0:5], CS6/CE1_B, CS7/CE2_B, WE0/BS_AB0/IORD, WE1/BS_AB1/IOWR,}
WE2/BS_AB2/PCOE, WE3/BS_AB3/PCWE, GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A[2:3]/GPL_B[2:3]/CS[2:3], UPWAITA/GPL_A4/AS, UPWAITB/GPL_B4, GPL_A5, ALE_B/DSCK/AT1,
OP2/MODCK1/STS, OP3/MODCK2/DSDO
Part V Power Considerations
The average chip-junction temperature, T_J, in °C can be obtained from the equation:
T_J = T_A + (P_{D •} θ_JA)
(1)
where
T_A = Ambient temperature, °C
θ_JA = Package thermal resistance, junction to ambient, °C/W
10
MPC850 (Rev. A/B/C) Hardware Specifications
MOTOROLA