XPC850ZT50BU Datasheet, PDF (71/76 Pages) Motorola, Inc – Communications Controller Hardware Specifications

Pin Assignments and Mechanical Dimensions of the PBGA
Figure 9-65 shows the JEDEC package dimensions of the PBGA.
A
D
256X
0.20 C
D2
0.35 C
E E2
A2
A3
A1
A
C
SEATING
PLANE
SIDE VIEW
4X
0.20
B
15X e
(E1)
4X e /2
TOP VIEW
(D1)
15X e
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
256X b
BOTTOM VIEW
0.30 ^M C A B
0.15 M C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM C.
4. PRIMARY DATUM C AND THE SEATING PLANE ARE
DEFINED BY THE SPHERICAL CROWNS OF THE
SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 1.91 2.35
A1 0.50 0.70
A2 1.12 1.22
A3 0.29 0.43
b 0.60 0.90
D 23.00 BSC
D1 19.05 REF
D2 19.00 20.00
E 23.00 BSC
E1 19.05 REF
E2 19.00 20.00
e
1.27 BSC
CASE 1130-01
ISSUE B
Figure 9-65. Package Dimensions for the Plastic Ball Grid Array (PBGA)—JEDEC
Standard
71
MPC850 (Rev. A/B/C) Hardware Specifications
MOTOROLA