XPC850ZT50BU Datasheet, PDF (69/76 Pages) Motorola, Inc – Communications Controller Hardware Specifications

Pin Assignments and Mechanical Dimensions of the PBGA
Figure 9-63 shows the JEDEC pinout of the PBGA package as viewed from the top surface.
U
PC14 PB28 PB27 PC12 TCK PB24 PB23 PA8 PA7 VDDL PA5 PC7 PC4 PD14 PD10 PD8
T
PC15 PA14 PA13 PA12 TMS TDI PC11 PB22 PC9 PB19 PA4 PB16 PD15 PD12 PD7 PD6
R
PA15 PB30 PB29 PC13 PB26 TRST N/C PC10 PA6 PB18 PC5 PD13 PD9 PD4 PD5 N/C
P
A8 A7 PB31 N/C TDO PB25 PA9 N/C PC8 PB17 PC6 PD11 PD3 IRQ7 IRQ1 IRQ0
A11 A9 A12 A6
N
D12 D13 D8 D0
A15 A14 A13 A10
A27 A19 A16 A17
VDDL A20 A21 N/C
A29 A23 A25 A24
A28 A30 A22 A18
GND
M
D23 _D27 D4 D1
L
D17 D10 D9 ^D11
K
D15 D14 D2 D3
J
D22 D18 D16 D5
H
D25 D20 D19 VDDL
A31 TSIZ0 A26 WE3
WE1 TSIZ1 N/C GPLA0
G
VDDH ^{D28 D24 D21 D6}
F
D26 D31 D29 D7
E
WE0 WE2 GPLA3 CS5 CS0 GPLA4 TS IRQ2 IPB7 IPB2 MODCK1 TEXP DP1 DP2 D30 CLKOUT
D
GPLA1 GPLA2 CS6 WR GPLA5 TEA BG IPB5 IPB1 IPB6 N/C RSTCONFWAITB DP0 DP3 N/C
CS4 CS7 CS2 GPLB4 ^BI
C
BR BURST IPB4 ALEB IRQ4 MODCK2HRESETSRESETPORESETXFC VDDSYN
N/C CS3 CS1 BDIP TA
B
BB IRQ6 IPB3 IPB0 VDDL EXTCLKEXTAL XTAL KAPWRVSSSYN1VSSSYN
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
Figure 9-63. Pin Assignments for the PBGA (Top View)—JEDEC Standard
For more information on the printed circuit board layout of the PBGA package, including
thermal via design and suggested pad layout, please refer to AN-1231/D, Plastic Ball Grid
Array Application Note available from your local Motorola sales office.
MOTOROLA
MPC850 (Rev. A/B/C) Hardware Specifications
69