XPC850ZT50BU Datasheet, PDF (67/76 Pages) Motorola, Inc – Communications Controller Hardware Specifications

Pin Assignments and Mechanical Dimensions of the PBGA
Table 9-27 identifies the packages and operating frequencies available for the MPC850.
Table 9-27. MPC850 Package/Frequency/Availability
Package Type
256-Lead Plastic Ball Grid Array
(ZT suffix)
256-Lead Plastic Ball Grid Array
(CZT suffix)
Frequency (MHz)
50
66
80
50
66
80
Temperature (Tj)
Order Number
0°C to 95°C
0°C to 95°C
0°C to 95°C
-40°C to 95°C
XPC850ZT50BU
XPC850DEZT50BU
XPC850SRZT50BU
XPC850DSLZT50BU
XPC850ZT66BU
XPC850DEZT66BU
XPC850SRZT66BU
XPC850ZT80BU
XPC850DEZT80BU
XPC850SRZT80BU
XPC850CZT50BU
XPC850DECZT50BU
XPC850SRCZT50BU
XPC850DSLCZT50BU
XPC850CZT66BU
XPC850DECZT66BU
XPC850SRCZT66BU
XPC850CZT80B
XPC850DECZT80B
XPC850SRCZT80B
9.1 Pin Assignments and Mechanical Dimensions of
the PBGA
The original pin numbering of the MPC850 conformed to a Motorola proprietary pin
numbering scheme that has since been replaced by the JEDEC pin numbering standard for
this package type. To support customers that are currently using the non-JEDEC pin
numbering scheme, two sets of pinouts, JEDEC and non-JEDEC, are presented in this
document.
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MPC850 (Rev. A/B/C) Hardware Specifications
MOTOROLA