N25Q128A11B1241F Datasheet, PDF (99/185 Pages) Micron Technology – 128-Mbit, 1.8 V, multiple I/O, 4-Kbyte subsector erase on boot sectors, XiP enabled, serial flash memory with 108 MHz SPI bus interface

N25Q128 - 1.8 V
Figure 28. Sector Erase instruction sequence
Instructions
S
0123456789
29 30 31
C
Instruction
24 Bit Address
DQ0
23 22
MSB
210
Sector_Erase
9.1.19
Bulk Erase (BE)
The Bulk Erase (BE) instruction sets all bits to '1' (FFh). Before it can be accepted, a Write
Enable (WREN) instruction must previously have been executed. After the Write Enable
(WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Bulk Erase (BE) instruction is entered by driving Chip Select (S) Low, followed by the
instruction code on Serial Data input (DQ0). Chip Select (S) must be driven Low for the
entire duration of the sequence.
Chip Select (S) must be driven High after the eighth bit of the instruction code has been
latched in, otherwise the Bulk Erase instruction is not executed. As soon as Chip Select (S)
is driven High, the self-timed Bulk Erase cycle (whose duration is tBE) is initiated. While the
Bulk Erase cycle is in progress, the Status Register may be read to check the value of the
Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Bulk
Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is
completed, the Write Enable Latch (WEL) bit is reset.
The Bulk Erase (BE) instruction is executed only if all Block Protect (BP3, BP2, BP1, BP0)
bits are 0. The Bulk Erase (BE) instruction is ignored if one, or more, sectors are protected.
Figure 29. Bulk Erase instruction sequence
S
C
DQ0
01234567
Instruction
AI13743
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