X9000 Datasheet, PDF (72/77 Pages) Intel Corporation – Core2 Duo Processor and Core2 Extreme Processor on 45-nm Process

Thermal Specifications
Table 16. Power Specifications for Dual-Core Standard Voltage Processors
Symbol
Processor
Number
Core Frequency & Voltage
TDP
T9500
T9300
T8300
T8100
Symbol
2.6 GHz & V_CCHFM
2.5 GHz & V_CCHFM
2.4 GHz & V_CCHFM
2.1 GHz & V_CCHFM
1.2 GHz & V_CCLFM
0.8 GHz & V_CCLFM
Parameter
P_AH,
P_SGNT
P_SLP
P_DSLP
P_DPRSLP
P_DC4
P_C6
T_J
Auto Halt, Stop Grant Power
at V_CCHFM
at V_CCSLFM
Sleep Power
at V_CCHFM
at V_CCSLFM
Deep Sleep Power
at V_CCHFM
at V_CCSLFM
Deeper Sleep Power
Intel® Enhanced Deeper Sleep State Power
Deep Power-Down Technology Power
Junction Temperature
Thermal Design
Power
Unit Notes
35
35
35
35
W
1, 4,
5, 6
22
12
Min Typ Max Unit
— — 12.5 W 2, 5, 7
5.0
— — 11.8 W 2, 5, 7
4.8
— — 5.5
2.2
W 2, 5, 8
— — 1.7 W
2, 8
— — 1.3 W
2, 8
— — 0.3 W
2, 8
0 — 105 °C
3, 4
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T_J has been reached.
Refer to Section 5.1 for more details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode is lesser than
TDP in HFM.
6.
At Tj of 105^oC
7.
At Tj of 50^oC
8.
At Tj of 35^oC
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Datasheet