X9000 Datasheet, PDF (29/77 Pages) Intel Corporation – Core2 Duo Processor and Core2 Extreme Processor on 45-nm Process

Electrical Specifications
3.8
3.9
Caution:
Table 5.
CMOS Signals
CMOS input signals are shown in Table 4. Legacy output FERR#, IERR# and other non-
AGTL+ signals (THERMTRIP# and PROCHOT#) use Open Drain output buffers. These
signals do not have setup or hold time specifications in relation to BCLK[1:0]. However,
all of the CMOS signals are required to be asserted for more than four BCLKs for the
processor to recognize them. See Section 3.10 for the DC specifications for the CMOS
signal groups.
Maximum Ratings
Table 5 specifies absolute maximum and minimum ratings. Within functional operation
limits, functionality and long-term reliability can be expected.
At conditions exceeding absolute maximum and minimum ratings, neither functionality
nor long-term reliability can be expected. Moreover, if a device is subjected to these
conditions for any length of time then, when returned to conditions within the
functional operating condition limits, it will either not function or its reliability will be
severely degraded.
Although the processor contains protective circuitry to resist damage from static
electric discharge, precautions should always be taken to avoid high static voltages or
electric fields.
Processor Absolute Maximum Ratings
Symbol
Parameter
T_STORAGE
V_CC
V_inAGTL+
V_{inAsynch_CMOS}
Processor storage temperature
Any processor supply voltage with
respect to V_SS
AGTL+ buffer DC input voltage with
respect to V_SS
CMOS buffer DC input voltage with
respect to V_SS
Min
-40
-0.3
-0.1
-0.1
Max
85
1.45
1.45
1.45
Unit
°C
V
Notes¹
2, 3, 4
V
V
NOTES:
1.
For functional operation, all processor electrical, signal quality, mechanical and thermal
specifications must be met.
2.
Storage temperature is applicable to storage conditions only. In this scenario, the
processor must not receive a clock, and no lands can be connected to a voltage bias.
Storage within these limits will not affect the long term reliability of the device. For
functional operation, please refer to the processor case temperature specifications.
3.
This rating applies to the processor and does not include any tray or packaging.
4.
Failure to adhere to this specification can affect the long term reliability of the processor.
Datasheet
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