X9000 Datasheet, PDF (71/77 Pages) Intel Corporation – Core2 Duo Processor and Core2 Extreme Processor on 45-nm Process

Thermal Specifications
5 Thermal Specifications
Maintaining the proper thermal environment is key to reliable, long-term system
operation. A complete thermal solution includes both component and system-level
thermal management features. To allow for the optimal operation and long-term
reliability of Intel processor-based systems, the system/processor thermal solution
should be designed so the processor remains within the minimum and maximum
junction temperature (T_J) specifications at the corresponding thermal design power
(TDP) value listed in Table 15. Analysis indicates that real applications are unlikely to
cause the processor to consume the theoretical maximum power dissipation for
sustained time periods.
Table 15.
Power Specifications for the Extreme Edition Processor
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit
Notes
TDP
X9000
Symbol
2.8 GHz & V_CCHFM
1.2 GHz & V_CCLFM
0.8 GHz & V_CCSLFM
Parameter
44
29
22
Min Typ Max
W
Unit
1, 4,
5, 6
Notes
P_AH,
P_SGNT
P_SLP
P_DSLP
P_DPRSLP
P_DC4
P_C6
T_J
Auto Halt, Stop Grant Power
at V_CCHFM
at V_CCSLFM
Sleep Power
at V_CCHFM
at V_CCSLFM
Deep Sleep Power
at V_CCHFM
at V_CCSLFM
Deeper Sleep Power
Intel® Enhanced Deeper Sleep State Power
Deep Power-Down Technology Power
Junction Temperature
— — 17.1 W 2, 5, 7
7.4
— — 16.1 W 2, 5, 7
7.1
— — 7.5
4.2
W 2, 5, 8
— — 1.9 W
2,8
— — 1.7 W
2,8
— — 1.3 W
2, 8
0 — 105 °C
3, 4
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T_J has been reached.
Refer to Section 5.1 for details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode is less than
TDP in HFM.
6.
At Tj of 105^oC
7.
At Tj of 50^oC
8.
At Tj of 35^oC
Datasheet
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