X9000 Datasheet, PDF (37/77 Pages) Intel Corporation – Core2 Duo Processor and Core2 Extreme Processor on 45-nm Process

Package Mechanical Specifications and Pin Information
4 Package Mechanical
Specifications and Pin
Information
4.1
Caution:
Package Mechanical Specifications
The processor is available in 6-MB and 3-MB, 478-pin Micro-FCPGA packages as well as
6-MB and 3-MB, 479-ball Micro-FCBGA packages. The package mechanical dimensions
are shown in Figure 7 through Figure 10.
The mechanical package pressure specifications are in a direction normal to the surface
of the processor. This requirement is to protect the processor die from fracture risk due
to uneven die pressure distribution under tilt, stack-up tolerances and other similar
conditions. These specifications assume that a mechanical attach is designed
specifically to load one type of processor.
Intel also specifies that 15-lbf load limit should not be exceeded on any of Intel’s BGA
packages so as to not impact solder joint reliability after reflow. This load limit ensures
that impact to the package solder joints due to transient bend, shock, or tensile loading
is minimized. The 15-lbf metric should be used in parallel with the 689 kPa (100 psi)
pressure limit as long as neither limits are exceeded. In some cases, designing to
15-lbf will exceed the pressure specification of 689 kPa (100 psi) and therefore should
be reduced to ensure both limits are maintained.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal or mechanical solution. Refer to the
Santa Rosa Platform Mechanical Design Guide for details.
The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors
are electrically conductive so care should be taken to avoid contacting the capacitors
with other electrically conductive materials on the motherboard. Doing so may short
the capacitors and possibly damage the device or render it inactive.
Datasheet
37