GW80314GSSL7NK Datasheet, PDF (66/88 Pages) Intel Corporation – Intel® GW80314 I/O Companion Chip

Intel® GW80314 I/O Companion Chip
Package Information
3.2.2
Case Temperature
When measuring case temperature, T_C, attention to detail is required to ensure accuracy. When a
thermocouple is used, calibrate is before taking measurements. Errors may result when the
measured surface temperature is affected by the surrounding ambient air temperature. Such errors
may be due to a poor thermal contact between thermocouple junction and the surface, heat loss by
radiation, or conduction through thermocouple leads.
To minimize measurement errors:
• Use a 35 gauge K-type thermocouple or equivalent.
• Attach the thermocouple bead or junction to the package top surface at a location
corresponding to the center of the die. The center of the die gives a more accurate
measurement and less variation as the boundary condition changes.
• Attach the thermocouple bead at a 0^o angle with respect to the package when no heat sink is
attached.
3.3
3.3.1
Socket Information
Table 23 and Table 24 provide vendor details for socket-headers and burn-in sockets for the
GW80314. This is neither an endorsement nor a warranty of the performance of any of the listed
products and/or companies.
Socket-Header Vendor
Table 23.
Socket-Header Vendor
Company
Advanced Interconnections
Factory
Representative
TBD
Phone/Fax #
TBD
Ironwood
TBD
TBD
BGA 544-Pin Socket Carrier
Socket:
FHSB1025-716GG
Carrier:
FHAX1025-715G
SG-BGA-6035
66
Datasheet