GW80314GSSL7NK Datasheet, PDF (65/88 Pages) Intel Corporation – Intel® GW80314 I/O Companion Chip

Intel® GW80314 I/O Companion Chip
Package Information
Table 22.
Thermal Simulation Data for the Intel^® GW80314 I/O Processor
Package Conditions
Package Type
HSBGA
Ball Count
Package Size (mm)
Mold Thickness (mm)
Pitch (mm)
Ball Matrix (mm)
Ball Row Depth
Thermal Ball Matrix
Vias
Pad Size (mm)
Die Size (mm)
Substrate Layer
Substrate Thickness (mm)
1025
40x40
1.17
1
39x39
7x7
11x11
144
12.5x12.5
11.62x11.62
4
0.56
PCB Conditions (JEDEC JESD51-9)
PCB Layer
PCB Dimensions (mm)
PCB Thickness (mm)
4
127.0x139.5
1.6
Environment Conditions
Maximum Junction Temperature (C)
Power Dissipation (W)
125
2.456 Typical
4.226 Max
Thermal Data
Property V_AIR (m/s)
0.00
1.00
2.00
Heat Dissipated from PCB (%)
(%)
Heat Dissipated from Others (%)
Heat Flow Path
Psi jt (C/W)
1.8
1.8
1.8
66.1
15.9
18.0
Datasheet
65