GW80314GSSL7NK Datasheet, PDF (41/88 Pages) Intel Corporation – Intel® GW80314 I/O Companion Chip

Intel® GW80314 I/O Companion Chip
Package Information
3.1.18
Figure 2.
1025-Lead HSBGA (Heat Slug Ball Grid Array) Package
Figure 2 shows the drawings for the 1025-lead HSBGA thermally enhanced package being used
for the GW80314 device.
1025-Lead HSBGA Package Drawing
PIN #1 CORNER
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
UT
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
34.50 REF
–E–
4.60*45º(4X)
–D–
34.50 REF
HEAT SLUG
ø26.5~27.5
TOP VIEW
ø0.30 S C A S B S
ø0.50 S C D S E S
ø0.10 M C
ø0.25 M C A B
ø0.50~ø0.70(1025X)
38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2
39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
UT
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
–B–
–A–
1.00
38.00
40.00 ± 0.20
0.20(4X)
Ball Pitch:
Ball Diameter:
1.00
0.60
Substrate Thickness:
0.56
Mold Thickness:
1.17
–A– SEATING PLANE
0.56 REF
1.17 REF
SIDE VIEW
0.40~0.60
2.23 ±0.13
B0957-02
Datasheet
41