MC9S08RC8 Datasheet, PDF (219/234 Pages) Freescale Semiconductor, Inc – Microcontrollers

Appendix B ^AppendixA
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains generic ordering information for MC9S08RD/RE/RG devices and an example of the
device numbering system.
Status
Memory type (9 = FLASH)
Core
Derivative
MC 9 S08 RG60 C XX E
Indicates RoHS-compliant packaging
Package designator
Temperature range
designator
C = –40 thru 85°C
Blank = 0 thru 70°C
See Table B-1 for package availability for each MC9S08RD/RE/RG device.
Table B-1. Package Descriptions
Pin Count
Type
28
Plastic Dual In-Line Package
28
Small Outline Integrated Circuit
32
Low Quad Flat Package
44
Low Quad Flat Package
48
Quad Flat Package
Abbreviation
PDIP
SOIC
LQFP
LQFP
QFN
Designator
P
DW
FJ
FG
FD
Document No.
98ASB42390B
98ASB42345B
98ASH70029A
98ASB42885B
98ARH99048A
B.2 Mechanical Drawings
The following pages are mechanical drawings for these packages:
• 28-Pin PDIP
• 28-Pin SOIC
• 32-Pin LQFP
• 44-Pin LQFP
• 48-Pin QFN
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
Freescale Semiconductor
219