IBIS4-6600 Datasheet, PDF (58/63 Pages) Cypress Semiconductor – High resolution 6.6 M Pixel Rolling shutter CMOS Image sensor

IBIS4-6600
Datasheet
8 Storage and handling
8.1 Storage conditions
Description Minimum
Temperature -10
Temperature -10
Note: RH = Relative Humidity
Maximum
66
38
Units
°C
°C
Conditions
@ 15% RH
@ 86% RH
8.2 Handling and solder precautions
Special care should be given when soldering image sensors with color filter arrays
(RGB color filters), onto a circuit board, since color filters are sensitive to high
temperatures. Prolonged heating at elevated temperatures may result in deterioration
of the performance of the sensor. The following recommendations are made to ensure
that sensor performance is not compromised during end-users’ assembly processes.
Board Assembly:
Device placement onto boards should be done in accordance with strict ESD controls
for Class 0, JESD22 Human Body Model, and Class A, JESD22 Machine Model
devices. Assembly operators should always wear all designated and approved
grounding equipment; grounded wrist straps at ESD protected workstations are
recommended including the use of ionized blowers. All tools should be ESD
protected.
Manual Soldering:
When a soldering iron is used the following conditions should be observed:
Use a soldering iron with temperature control at the tip.
The soldering iron tip temperature should not exceed 350°C.
The soldering period for each pin should be less than 5 seconds.
Reflow Soldering:
Figure 34 shows the maximum recommended thermal profile for a reflow soldering
system. If the temperature/time profile exceeds these recommendations damage to the
image sensor may occur.
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: [e-mail] Document #: 38-05708 Rev.**(Revision 1.3 )
Page 58 of 63