IBIS4-6600 Datasheet, PDF (47/63 Pages) Cypress Semiconductor – High resolution 6.6 M Pixel Rolling shutter CMOS Image sensor

IBIS4-6600
Datasheet
6 Pad positioning and packaging
6.1 Bare die
The IBIS4-6600 image sensor has 68 pins, 17 pins on each side. The die size from
pad-edge to pad-edge (without scribe-line) is
9120.10 µm (X) by 11960.10 µm (Y)
Scribe lines will take about 100 to 150 µm extra on each side.
Pin 1 is located in the middle of the left side, indicated by a “1” on the layout.
A logo and some identification tags can be found on the lower right of the die (see
Figure 25).
Pad 60
Pad 61
Bonding
Probe
Pad 44
Pad 43
7777.00 µm
(2222 * 3.5)
10549.00 µm
(3014 * 3.5)
Pad 1
Origin
(0,0)
4404.47 µm
Pixel array center
6427.00 µm
Test diodes
Probe
Bonding
Pixel 0,0
11960.10µm
Bonding
Probe
Identification
Pad 9
Pad 10
Probe
Bonding _9120.10µm
Pad 27
Pad 26
Figure 27: Layout of the IBIS4-6600 sensor
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: [e-mail] Document #: 38-05708 Rev.**(Revision 1.3 )
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