IBIS4-6600 Datasheet, PDF (54/63 Pages) Cypress Semiconductor – High resolution 6.6 M Pixel Rolling shutter CMOS Image sensor

IBIS4-6600
Datasheet
6.3.2 Bonding of the IBIS4-6600 sensor in the 68-pins LCC package
Figure 32. Bonding scheme.
The middle of the die corresponds with the middle of the package cavity (± 50 µm).
Pixel 0,0 is located at x = -4023 um , y = -4806 um (mechanical centre of the
die/package is x = 0, y = 0).
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