IBIS4-6600 Datasheet, PDF (52/63 Pages) Cypress Semiconductor – High resolution 6.6 M Pixel Rolling shutter CMOS Image sensor

IBIS4-6600
Datasheet
Figure 29: Side view (all dimensions in inch).
Table 20: Side view dimensions.
Dimension
A
B
C
D
E
F
G
Description
Glass (thickness)
Die – Si (thickness)
Die attach-bondline (thickness)
Glass attach-bondline
(thickness)
Imager to lid-outer surface
Imager to lid-inner surface
Imager to seating plane of pkg
Min
0.037
0.002
0.002
(inch)
Typ
0.039
0.029
0.004
0.004
0.081
0.039
0.061
Max
0.041
0.006
0.006
Min
0.950
0.030
0.030
(mm)
Typ
1.000
0.740
0.060
0.070
2.048
0.978
1.562
Max
1.050
0.090
0.110
D- Glass lid sealing thickness
A
E
F
G
C- Die attach thickness
B - Die
Figure 30: Side view dimensions.
Cypress Semiconductor Corporation 3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: [e-mail] Document #: 38-05708 Rev.**(Revision 1.3 )
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