W25M02GVZEIG-TR Datasheet, PDF (8/68 Pages) Winbond – 3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS

W25M02GV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25M02GV is offered in an 8-pad WSON 8x6-mm (package code ZE), and two 24-ball 8x6-mm TFBGA
(package code TB & TC) packages as shown in Figure 1a-b respectively. Package diagrams and
dimensions are illustrated at the end of this datasheet.
3.1 Pad Configuration WSON 8x6-mm
Top View
/CS
18
VCC
DO (IO₁)
/WP (IO₂)
GND
27
36
45
/HOLD (IO₃)
CLK
DI (IO₀)
Figure 1a. W25M02GV Pad Assignments, 8-pad WSON 8x6-mm (Package Code ZE)
3.2 Pad Description WSON 8x6-mm
PAD NO.
1
2
3
4
5
6
7
8
PAD NAME
/CS
DO (IO1)
/WP (IO2)
GND
DI (IO0)
CLK
/HOLD (IO3)
VCC
I/O
FUNCTION
I
Chip Select Input
I/O
Data Output (Data Input Output 1)⁽¹⁾
I/O
Write Protect Input ( Data Input Output 2)⁽²⁾
Ground
I/O
Data Input (Data Input Output 0)⁽¹⁾
I
Serial Clock Input
I/O
Hold Input (Data Input Output 3)⁽²⁾
Power Supply
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD functions are only available for Standard/Dual SPI.
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