W25M02GVZEIG-TR Datasheet, PDF (67/68 Pages) Winbond – 3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS

W25M02GV
11.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25M02GV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use a 12-digit
Product Number for ordering. However, due to limited space, the Top Side Marking on all packages uses
an abbreviated 11-digit number.
Industrial Temperature:
PACKAGE TYPE DENSITY
ZE
WSON-8 8x6mm
TB
TFBGA-24 8x6mm
(5x5-1 Ball Array)
TC
TFBGA-24 8x6mm
(6x4 Ball Array)
2x1G-bit
2x1G-bit
2x1G-bit
PRODUCT NUMBER
W25M02GVZEIG
W25M02GVZEIT
W25M02GVTBIG
W25M02GVTBIT
W25M02GVTCIG
W25M02GVTCIT
TOP SIDE MARKING
25M02GVZEIG
25M02GVZEIT
25M02GVTBIG
25M02GVTBIT
25M02GVTCIG
25M02GVTCIT
Note:
W25M02GVxxIG: BUF=1 (Buffer Read Mode) is the default value for both stacked dies after power up. BUF bit can
be written to 0 individually.
W25M02GVxxIT: BUF=0 (Continuous Read Mode) is the default value for both stacked dies after power up. BUF bit
can be written to 1 individually.
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Publication Release Date: July 1, 2015
Preliminary - Revision B