W25M02GVZEIG-TR Datasheet, PDF (66/68 Pages) Winbond – 3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS

11. ORDERING INFORMATION
W25M02GV
W = Winbond
W⁽¹⁾ 25M 02G V xx I⁽¹⁾
25M = Serial MCP SpiFlash Memory with SpiStack
02G = 2G-bit (2 x 1G-bit) Serial SLC NAND Flash Memory
V = 2.7V to 3.6V
ZE = 8-pad WSON 8x6mm
TB = 24-ball TFBGA 8x6-mm (5x5 ball array)
TC = 24-ball TFBGA 8x6-mm (6x4 ball array)
I = Industrial (-40°C to +85°C)
(2)
G=
T=
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
and BUF=1 is the default value after power up
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
and BUF=0 is the default value after power up
Notes:
1. The “W” prefix is not included on the part marking.
2. Standard bulk shipments are in tray for WSON and TFBGA packages. For other packing options, please
specify when placing orders.
- 65 -