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W25M02GVZEIG-TR Datasheet, PDF (7/68 Pages) Winbond – 3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS | |||
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W25M02GV
1. GENERAL DESCRIPTIONS
The W25M02GV (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N
Serial SLC NAND SpiFlash® series by stacking two individual W25N01GV die into a standard 8-pin
package. It offers the highest memory density for the low pin-count package, as well as Concurrent
Operations in Serial Flash memory for the first time. The W25M SpiStack® series is ideal for small form
factor system designs, and applications that demand high Program/Erase data throughput. All W25N
SpiFlash family devices are offered in space-saving packages which were impossible to use in the past for
the typical NAND flash memory.
The SpiStack® product series introduces a new âSoftware Die Select (C2h)â instruction, and a factory
assigned âDie ID#â for each stacked die. Each W25N01GV die can be accessed independently even
though the interface is shared. The SpiStack® feature only allows a single die to be Active and have
control of the SPI interface at any given time to avoid bus contention.
The W25M02GV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock,
Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up
to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and
416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions.
The W25M02GV provides a new Continuous Read Mode that allows for efficient access to the entire
memory array with a single Read command. This feature is ideal for code shadowing applications.
Additionally, the device supports JEDEC standard manufacturer and device ID, one 2,048-Byte Unique ID
page, one 2,048-Byte parameter page and ten 2,048-Byte OTP pages. To provide better NAND flash
memory manageability, user configurable internal ECC, bad block management are also available in
W25M02GV.
2. FEATURES
⢠New Family of SpiFlash Memories
â W25M02GV: 2x1G-bit / 2x128M-byte
â Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
â Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
â Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
â Compatible SPI serial flash commands
⢠Highest Performance Serial NAND Flash
â 104MHz Standard/Dual/Quad SPI clocks
â 208/416MHz equivalent Dual/Quad SPI
â 50MB/S continuous data transfer rate
â Fast Program/Erase performance
â More than 100,000 erase/program cycles
â More than 10-year data retention
⢠Efficient âContinuous Read Modeâ(1)
â Alternative method to the Buffer Read Mode
â No need to issue âPage Data Readâ between
Read commands
â Allows direct read access to the entire array
⢠Flexible âConcurrent Operationsâ
â Independent single die access
â Allows âRead while Program/Eraseâ
â Allows âMulti Die Program/Eraseâ
â Improves Program/Erase throughput
⢠Low Power, Wide Temperature Range
â Single 2.7 to 3.6V supply
â 25mA active, 20µA standby current
â -40°C to +85°C operating range
⢠Flexible Architecture with 128KB blocks
â Uniform 128K-Byte Block Erase
â Flexible page data load methods
⢠Advanced Features
â On chip 1-Bit ECC for memory array
â ECC status bits indicate ECC results
â bad block management and LUT(2) access
â Software and Hardware Write-Protect
â Power Supply Lock-Down and OTP protection
â 2KB Unique ID and 2KB parameter pages
â Ten 2KB OTP pages(3)
⢠Space Efficient Packaging
â 8-pad WSON 8x6-mm
â 24-ball TFBGA 8x6-mm
â Contact Winbond for other package options
Notes:
1. Only the Read command structures are different between
the âContinuous Read Modeâ and the âBuffer Read Modeâ,
all other commands are identical.
2. LUT stands for Look-Up Table.
3. OTP pages can only be programmed.
Publication Release Date: July 1, 2015
-6-
Preliminary - Revision B
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