W25M02GVZEIG-TR Datasheet, PDF (29/68 Pages) Winbond – 3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS

W25M02GV
8.2.3 Read JEDEC ID (9Fh)
The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI compatible serial
memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low and shifting the
instruction code “9Fh” followed by 8 dummy clocks. The JEDEC assigned Manufacturer ID byte for
Winbond (EFh) and two Device ID bytes are then shifted out on the falling edge of CLK with most
significant bit (MSB) first as shown in Figure 6. For memory type and capacity values refer to
Manufacturer and Device Identification table.
Figure 6. Read JEDEC ID Instruction
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Publication Release Date: July 1, 2015
Preliminary - Revision B