SMJ320C40_15 Datasheet, PDF (64/65 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

MECHANICAL DATA
GF (S-CPGA-P325)
MCPG013F – JANUARY 1995 – REVISED DECEMBER 2001
CERAMIC PIN GRID ARRAY
1.717 (43,61)
1.683 (42,75) ^TYP
0.100 (2,54)
1.879 (47,73)
1.841 (46,76) ^SQ
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
R
N
L
J
G
E
C
A
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35
Bottom View
A1 Corner
0.060 (1,52)
0.040 (1,02)
0.050 (1,27)
0.020 (0,51)
0.016 (0,41)
0.048 (1,22) DIA 4 Places
0.190 (4,83)
0.170 (4,32)
0.080 (2,03) TYP
0.050 (1,27) TYP
0.150 (3,81)
TYP
0.026 (0,660)
0.006 (0,152)
0.165 (4,19)
0.120 (3,05)
0.200 (5,08)
0.145 (3,68)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Index mark can appear on top or bottom, depending on package vendor.
D. Pins are located within 0.010 (0,25) diameter of true position relative to
each other at maximum material condition and within 0.030 (0,76) diameter
relative to the edge of the ceramic.
E. This package can be hermetically sealed with metal lids or with ceramic lids using glass frit.
F. The pins can be gold-plated or solder-dipped.
G. Package thickness of 0.165 (4,19) / 0.120 (3,05) includes package body and lid.
H. Falls within JEDEC MO-128AK
DETAIL A
4040035-2 / F 11/01
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1