SMJ320C40_15 Datasheet, PDF (61/65 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

PACKAGE OPTION ADDENDUM
www.ti.com
24-Sep-2015
Orderable Device
SM320C40HFHS60
SMJ320C40GFM40
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE
CFP
HFH 352
1
Eco Plan
(2)
TBD
ACTIVE
CPGA
GF 325
1
TBD
Lead/Ball Finish
(6)
Call TI
Call TI
MSL Peak Temp
(3)
N / A for Pkg Type
Op Temp (°C)
-55 to 100
N / A for Pkg Type -55 to 125
SMJ320C40GFM50
ACTIVE
CPGA
GF 325
1
TBD
Call TI
N / A for Pkg Type -55 to 125
SMJ320C40GFS60
ACTIVE
CPGA
GF 325
1
TBD
Call TI
N / A for Pkg Type -55 to 100
SMJ320C40HFHM40
ACTIVE
CFP
HFH 352
1
TBD
Call TI
N / A for Pkg Type -55 to 125
SMJ320C40HFHM50
ACTIVE
CFP
HFH 352
1
TBD
Call TI
N / A for Pkg Type -55 to 125
SMJ320C40HFHS60
ACTIVE
CFP
HFH 352
1
TBD
Call TI
N / A for Pkg Type -55 to 100
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
SM320C40HFHS60
5962-9466902QX
A
SMJ320C40GFM40
5962-9466903QX
A
SMJ320C40GFM50
5962-9466904QX
A
SMJ320C40GFS60
5962-9466902QY
C
SMJ320C40HFHM4
0
5962-9466903QY
C
SMJ320C40HFHM5
0
5962-9466904QY
C
SMJ320C40HFHS6
0
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
Samples