SMJ320C40_15 Datasheet, PDF (29/65 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

SMJ320C40, TMP320C40
DIGITAL SIGNAL PROCESSORS
SGUS017H -- OCTOBER 1993 -- REVISED OCTOBER 2001
Table 2. SMJ320C40 Die Pad/TAB Lead Information : Rev. 5 (0,72 μm) (Continued)
DIE SIDE #4
C40 DIE BOND DIE/TAB BOND X-COORDINATE OF THE Y-COORDINATE OF THE
PAD LOCATIONS PAD IDENTITY
DIE BOND PAD
DIE BOND PAD
244
CV_SS
245
LD31
246
LD30
247
LD29
248
LD28
249
LDDV_DD
250
LD27
251
LD26
252
LD25
253
LD24
254
LD23
255
LD22
256
LD21
257
LD20
258
LD19
259
LD18
260
LD17
261
LDDV_DD
262
CV_SS
263
DV_SS
264
IV_SS
265
LD16
266
LD15
267
LD14
268
LD13
269
LD12
270
LD11
271
LD10
272
LD9
273
LD8
274
LD7
275
LD6
276
LD5
277
LDDV_DD
278
LD4
279
LD3
280
LD2
281
LD1
282
LD0
283
V_DDL
284
V_SSL
285
CV_SS
10953.72
10827.72
10701.72
10575.72
10449.72
10323.72
10197.72
10071.72
9945.72
9819.72
9693.72
9567.72
9441.72
9315.72
9189.72
9063.72
8937.72
8811.72
8685.72
8559.72
8433.72
8307.72
8181.72
8055.72
7929.72
7803.72
7677.72
7551.72
7425.72
7299.72
7173.72
7047.72
6921.72
6795.72
6669.72
6543.72
6417.72
6291.72
6165.72
6038.10
5912.10
5786.10
11819.88
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
126.00 (244, 245)
126.00 (245, 246)
126.00 (246, 247)
126.00 (247, 248)
126.00 (248, 249)
126.00 (249, 250)
126.00 (250, 251)
126.00 (251, 252)
126.00 (252, 253)
126.00 (253, 254)
126.00 (254, 255)
126.00 (255, 256)
126.00 (256, 257)
126.00 (257, 258)
126.00 (258, 259)
126.00 (259, 260)
126.00 (260, 261)
126.00 (261, 262)
126.00 (262, 263)
126.00 (263, 264)
126.00 (264, 265)
126.00 (265, 266)
126.00 (266, 267)
126.00 (267, 268)
126.00 (268, 269)
126.00 (269, 270)
126.00 (270, 271)
126.00 (271, 272)
126.00 (272, 273)
126.00 (273, 274)
126.00 (274, 275)
126.00 (275, 276)
126.00 (276, 277)
126.00 (277, 278)
126.00 (278, 279)
126.00 (279, 280)
126.00 (280, 281)
126.00 (281, 282)
127.62 (282, 283)
126.00 (283, 284)
126.00 (284, 285)
126.00 (285, 286)
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