SMJ320C40_15 Datasheet, PDF (30/65 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

SMJ320C40, TMP320C40
DIGITAL SIGNAL PROCESSORS
SGUS017H -- OCTOBER 1993 -- REVISED OCTOBER 2001
Table 2. SMJ320C40 Die Pad/TAB Lead Information : Rev. 5 (0,72 μm) (Continued)
DIE SIDE #4 (CONTINUED)
C40 DIE BOND DIE/TAB BOND X-COORDINATE OF THE Y-COORDINATE OF THE
PAD LOCATIONS PAD IDENTITY
DIE BOND PAD
DIE BOND PAD
286
DV_SS
287
A30
288
A29
289
A28
290
GADV_DD
291
A27
292
A26
293
A25
294
A24
295
A23
296
A22
297
A21
298
A20
299
A19
300
A18
301
A17
302
GADV_DD
303
CV_SS
304
DV_SS
305
A16
306
A15
307
A14
308
A13
309
A12
310
A11
311
A10
312
A9
313
A8
314
A7
315
A6
316
A5
317
A4
318
GADV_DD
319
A3
320
A2
321
A1
322
A0
323
CV_SS
324
DV_SS
325
SUBS
5660.10
5534.10
5408.10
5282.10
5156.10
5030.10
4904.10
4778.10
4652.10
4526.10
4400.10
4274.10
4148.10
4022.10
3896.10
3770.10
3644.10
3518.10
3392.10
3266.10
3140.10
3014.10
2888.10
2762.10
2636.10
2510.10
2384.10
2258.10
2132.10
2006.10
1880.10
1754.10
1628.10
1502.10
1376.10
1250.10
1124.10
998.10
440.10
-- 189.90
11819.88
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
126.00 (286, 287)
126.00 (287, 288)
126.00 (288, 289)
126.00 (289, 290)
126.00 (290, 291)
126.00 (291, 292)
126.00 (292, 293)
126.00 (293, 294)
126.00 (294, 295)
126.00 (295, 296)
126.00 (296, 297)
126.00 (297, 298)
126.00 (298, 299)
126.00 (299, 300)
126.00 (300, 301)
126.00 (301, 302)
126.00 (302, 303)
126.00 (303, 304)
126.00 (304, 305)
126.00 (305, 306)
126.00 (306, 307)
126.00 (307, 308)
126.00 (308, 309)
126.00 (309, 310)
126.00 (310, 311)
126.00 (311, 312)
126.00 (312, 313)
126.00 (313, 314)
126.00 (314, 315)
126.00 (315, 316)
126.00 (316, 317)
126.00 (317, 318)
126.00 (318, 319)
126.00 (319, 320)
126.00 (320, 321)
126.00 (321, 322)
126.00 (322, 323)
558.00 (323, 324)
630.00 (324, 325)
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