SMJ320C40_15 Datasheet, PDF (28/65 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

SMJ320C40, TMP320C40
DIGITAL SIGNAL PROCESSORS
SGUS017H -- OCTOBER 1993 -- REVISED OCTOBER 2001
Table 2. SMJ320C40 Die Pad/TAB Lead Information : Rev. 5 (0,72 μm) (Continued)
DIE SIDE #3 (CONTINUED)
C40 DIE BOND DIE/TAB BOND X-COORDINATE OF THE Y-COORDINATE OF THE
PAD LOCATIONS PAD IDENTITY
DIE BOND PAD
DIE BOND PAD
205
DV_DD
206
DV_SS
207
LA30
208
LA29
209
LA28
210
LA27
211
LADV_DD
212
LA26
213
LA25
214
LA24
215
LA23
216
LA22
217
LA21
218
LA20
219
LA19
220
LA18
221
LA17
222
LA16
223
LADV_DD
224
CV_SS
225
DV_SS
226
LA15
227
LA14
228
LA13
229
LA12
230
LA11
231
LA10
232
LA9
233
LA8
234
LA7
235
LA6
236
LA5
237
LA4
238
LADV_DD
239
LA3
240
LA2
241
LA1
242
LA0
243
DV_SS
11779.74
6620.40
6746.40
6873.84
6999.84
7125.84
7251.84
7377.84
7503.84
7629.84
7755.84
7881.84
8007.84
8133.84
8259.84
8385.84
8511.84
8637.84
8763.84
8889.84
9015.84
9141.84
9267.84
9393.84
9519.84
9645.84
9771.84
9897.84
10023.84
10149.84
10275.84
10401.84
10527.84
10653.84
10779.84
10905.84
11031.84
11157.84
11283.84
11489.76
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
126.00 (205, 206)
127.44 (206, 207)
126.00 (207, 208)
126.00 (208, 209)
126.00 (209, 210)
126.00 (210, 211)
126.00 (211, 212)
126.00 (212, 213)
126.00 (213, 214)
126.00 (214, 215)
126.00 (215, 216)
126.00 (216, 217)
126.00 (217, 218)
126.00 (218, 219)
126.00 (219, 220)
126.00 (220, 221)
126.00 (221, 222)
126.00 (222, 223)
126.00 (223, 224)
126.00 (224, 225)
126.00 (225, 226)
126.00 (226, 227)
126.00 (227, 228)
126.00 (228, 229)
126.00 (229, 230)
126.00 (230, 231)
126.00 (231, 232)
126.00 (232, 233)
126.00 (233, 234)
126.00 (234, 235)
126.00 (235, 236)
126.00 (236, 237)
126.00 (237, 238)
126.00 (238, 239)
126.00 (239, 240)
126.00 (240, 241)
126.00 (241, 242)
205.92 (242, 243)
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