SMJ320C40_15 Datasheet, PDF (57/65 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

GF (S-CPGA-P325)
1.717 (43,61)
1.683 (42,75) ^TYP
0.100 (2,54)
SMJ320C40, TMP320C40
DIGITAL SIGNAL PROCESSORS
SGUS017H -- OCTOBER 1993 -- REVISED OCTOBER 2001
MECHANICAL DATA
CERAMIC PIN GRID ARRAY
1.879 (47,73)
1.841 (46,76) ^SQ
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
R
N
L
J
G
E
C
A
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35
0.060 (1,52)
0.040 (1,02)
0.050 (1,27)
0.020 (0,51)
0.016 (0,41)
0.048 (1,22) DIA 4 Places
0.190 (4,83)
0.170 (4,32)
0.080 (2,03) TYP
0.050 (1,27) TYP
0.150 (3,81)
TYP
0.026 (0,660)
0.006 (0,152)
0.165 (4,19)
0.120 (3,05)
0.200 (5,08)
0.145 (3,68)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Index mark can appear on top or bottom, depending on package vendor.
D. Pins are located within 0.010 (0,25) diameter of true position relative to
each other at maximum material condition and within
0.030 (0,76) diameter relative to the edge of the ceramic.
E. This package can be hermetically sealed with metal lids
or with ceramic lids using glass frit.
F. The pins can be gold-plated or solder-dipped.
G. Package thickness of 0.165 (4,19) / 0.120 (3,05) includes
package body and lid.
H. Falls within JEDEC MO-128AK
DETAIL A
4040035-2/E 03/97
Thermal Resistance
Characteristics
Parameter
°C/W
Air Flow
LFPM
RΘ_JC
1.7
N/A
RΘ_JA
RΘJA
RΘ_JA
RΘ_JA
RΘ_JA
RΘ_JA
10.9
0
9.8
200
7.0
400
6.4
600
5.6
800
5.5
1000
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