SMJ320C40_15 Datasheet, PDF (27/65 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

SMJ320C40, TMP320C40
DIGITAL SIGNAL PROCESSORS
SGUS017H -- OCTOBER 1993 -- REVISED OCTOBER 2001
Table 2. SMJ320C40 Die Pad/TAB Lead Information : Rev. 5 (0,72 μm) (Continued)
DIE SIDE #3
C40 DIE BOND DIE/TAB BOND X-COORDINATE OF THE Y-COORDINATE OF THE
PAD LOCATIONS PAD IDENTITY
DIE BOND PAD
DIE BOND PAD
163
C0D2
164
C0D1
165
C0D0
166
CV_SS
167
DV_DD
168
ROMEN
169
IIOF0
170
DV_SS
171
IIOF1
172
IIOF2
173
IIOF3
174
NMI
175
LSTRB0
176
LR/W0
177
LPAGE0
178
LRDY0
179
LCE0
180
LSTRB1
181
LR/W1
182
DV_DD
183
CV_SS
184
LPAGE1
185
LRDY1
186
LCE1
187
LDE
188
TCLK0
189
TCLK1
190
H3
191
H1
192
LAE
193
IV_SS
194
LLOCK
195
LSTAT0
196
LSTAT1
197
LSTAT2
198
LSTAT3
199
IACK
200
V_DDL
201
V_SSL
202
X1
203
X2/CLKIN
204
CV_SS
11779.74
810.00
936.00
1062.00
1188.00
1314.00
1470.42
1622.88
1748.88
1874.88
2000.88
2126.88
2283.30
2435.40
2561.40
2687.40
2843.82
3016.62
3168.72
3294.72
3420.72
3546.72
3672.72
3829.14
4001.94
4174.74
4326.84
4452.84
4578.84
4704.84
4861.26
5013.36
5139.36
5265.36
5391.36
5517.36
5643.36
5770.80
5896.80
6022.80
6154.74
6326.28
6494.40
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
126.00 (163, 164)
126.00 (164, 165)
126.00 (165, 166)
126.00 (166, 167)
156.42 (167, 168)
152.46 (168, 169)
126.00 (169, 170)
126.00 (170, 171)
126.00 (171, 172)
126.00 (172, 173)
156.42 (173, 174)
152.10 (174, 175)
126.00 (175, 176)
126.00 (176, 177)
156.42 (177, 178)
172.80 (178, 179)
152.10 (179, 180)
126.00 (180, 181)
126.00 (181, 182)
126.00 (182, 183)
126.00 (183, 184)
156.42 (184, 185)
172.80 (185, 186)
172.80 (186, 187)
152.10 (187, 188)
126.00 (188, 189)
126.00 (189, 190)
126.00 (190, 191)
156.42 (191, 192)
152.10 (192, 193)
126.00 (193, 194)
126.00 (194, 195)
126.00 (195, 196)
126.00 (196, 197)
126.00 (197, 198)
127.44 (198, 199)
126.00 (199, 200)
126.00 (200, 201)
131.94 (201, 202)
171.58 (202, 203)
168.12 (203, 204)
126.00 (204, 205)
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