SMJ320C40_15 Datasheet, PDF (25/65 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

SMJ320C40, TMP320C40
DIGITAL SIGNAL PROCESSORS
SGUS017H -- OCTOBER 1993 -- REVISED OCTOBER 2001
Table 2. SMJ320C40 Die Pad/TAB Lead Information : Rev. 5 (0,72 μm) (Continued)
DIE SIDE #2
C40 DIE BOND DIE/TAB BOND X-COORDINATE OF THE Y-COORDINATE OF THE
PAD LOCATIONS PAD IDENTITY
DIE BOND PAD
DIE BOND PAD
82
CV_SS
83
DV_SS
84
DV_DD
85
C5D7
0.00
1062.00
1188.00
1314.00
86
C5D6
1440.00
87
C5D5
1566.00
88
C5D4
1692.00
89
C5D3
1818.00
90
C5D2
1944.00
91
C5D1
2070.00
92
C5D0
2196.00
93
DV_DD
94
C4D7
2322.00
2448.00
95
C4D6
2574.00
96
C4D5
2700.00
97
C4D4
2813.40
98
C4D3
2952.00
99
C4D2
3078.00
100
C4D1
3204.00
101
C4D0
3330.00
102
CV_SS
103
DV_SS
104
DV_DD
105
C3D7
3456.00
3582.00
3708.00
3834.00
0.00
106
C3D6
3960.00
107
C3D5
4086.00
108
C3D4
4212.00
109
C3D3
4338.00
110
C3D2
4464.00
111
C3D1
4590.00
112
C3D0
4716.00
113
DV_DD
114
IV_SS
115
C2D7
4842.00
4968.00
5094.00
116
C2D6
5220.00
117
C2D5
5346.00
118
C2D4
5472.00
119
C2D3
5598.00
120
C2D2
5724.00
121
C2D1
5850.00
122
C2D0
5976.00
123
CV_SS
6102.00
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
1062.00 (82, 83)
126.00 (83, 84)
126.00 (84, 85)
126.00 (85, 86)
126.00 (86, 87)
126.00 (87, 88)
126.00 (88, 89)
126.00 (89, 90)
126.00 (90, 91)
126.00 (91, 92)
126.00 (92, 93)
126.00 (93, 94)
126.00 (94, 95)
126.00 (95, 96)
126.00 (96, 97)
126.00 (97, 98)
126.00 (98, 99)
126.00 (99, 100)
126.00 (100, 101)
126.00 (101, 102)
126.00 (102, 103)
126.00 (103, 104)
126.00 (104, 105)
126.00 (105, 106)
126.00 (106, 107)
126.00 (107, 108)
126.00 (108, 109)
126.00 (109, 110)
126.00 (110, 111)
126.00 (111, 112)
126.00 (112, 113)
126.00 (113, 114)
126.00 (114, 115)
126.00 (115, 116)
126.00 (116, 117)
126.00 (117, 118)
126.00 (118, 119)
126.00 (119, 120)
126.00 (120, 121)
126.00 (121, 122)
126.00 (122, 123)
126.00 (123, 124)
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