SMJ320C40_15 Datasheet, PDF (24/65 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

SMJ320C40, TMP320C40
DIGITAL SIGNAL PROCESSORS
SGUS017H -- OCTOBER 1993 -- REVISED OCTOBER 2001
Table 2. SMJ320C40 Die Pad/TAB Lead Information : Rev. 5 (0,72 μm) (Continued)
DIE SIDE #1 (CONTINUED)
C40 DIE BOND DIE/TAB BOND X-COORDINATE OF THE Y-COORDINATE OF THE
PAD LOCATIONS PAD IDENTITY
DIE BOND PAD
DIE BOND PAD
43
LOCK
44
V_DDL
45
V_SSL
46
CE0
47
RDY0
48
DE
49
TCK
50
TDO
51
TDI
52
TMS
53
TRST
54
EMU0
55
EMU1
56
DV_SS
57
DV_DD
58
PAGE1
59
R/W1
60
STRB1
61
STAT0
62
STAT1
63
IV_SS
64
STAT2
65
STAT3
66
PAGE0
67
R/W0
68
STRB0
69
AE
70
RESETLOC 1
71
DV_DD
72
RESETLOC 0
73
RESET
74
CRDY5
75
CSTRB5
76
CACK5
77
CREQ5
78
CRDY4
79
CSTRB4
80
CACK4
81
CREQ4
-- 429.48
5973.12
5847.12
5721.12
5564.70
5391.90
5219.10
5046.30
4894.20
4737.78
4564.98
4392.18
4240.08
4114.08
3988.08
3962.08
3736.08
3610.08
3484.08
3358.08
3232.08
3106.08
2980.08
2854.08
2726.64
2600.64
2474.64
2318.22
2143.98
1991.88
1835.46
1662.66
1510.56
1384.56
1258.56
1132.56
1006.56
880.56
754.56
628.56
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
126.00 (43, 44)
126.00 (44, 45)
156.42 (45, 46)
172.80 (46, 47)
172.80 (47, 48)
172.80 (48, 49)
152.10 (49, 50)
156.42 (50, 51)
172.80 (51, 52)
172.80 (52, 53)
151.10 (53, 54)
126.00 (54, 55)
126.00 (55, 56)
126.00 (56, 57)
126.00 (57, 58)
126.00 (58, 59)
126.00 (59, 60)
126.00 (60, 61)
126.00 (61, 62)
126.00 (62, 63)
126.00 (63, 64)
126.00 (64, 65)
127.44 (65, 66)
126.00 (66, 67)
126.00 (67, 68)
156.42 (68, 69)
174.24 (69, 70)
152.10 (70, 71)
156.42 (71, 72)
172.80 (72, 73)
172.80 (73, 74)
126.00 (74, 75)
126.00 (75, 76)
126.00 (76, 77)
126.00 (77, 78)
126.00 (78, 79)
126.00 (79, 80)
126.00 (80, 81)
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