DS90UH925Q-Q1 Datasheet, PDF (47/56 Pages) Texas Instruments – 720p 24-bit Color FPD-Link III Serializer with HDCP

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DS90UH925Q-Q1
SNLS336J – OCTOBER 2010 – REVISED NOVEMBER 2014
10.2 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown below:
Figure 27. No Pullback WQFN, Single Row Reference Diagram
Table 8. No Pullback WQFN Stencil Aperture Summary
Device
Pin MKT Dwg PCB I/O
Count
Pad Size
(mm)
PCB
Pitch
(mm)
DS90UH925
Q-Q1
48
SQA48A
0.25 x
0.6
0.5
PCB DAP
size (mm)
5.1 x 5.1
Stencil I/O
Aperture
(mm)
0.25 x 0.7
Stencil DAP
Aperture
(mm)
Number of
DAP
Aperture
Openings
1.1 x 1.1
16
Gap Between DAP
Aperture (Dim A
mm)
0.2
Figure 28. 48-Pin WQFN Stencil Example of Via and Opening Placement
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