DS90UB913A-Q1 Datasheet, PDF (43/51 Pages) Texas Instruments – 25-MHz to 100-MHz 10/12-Bit FPD-Link III Serializer

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DS90UB913A-Q1
SNLS443C – MAY 2013 – REVISED APRIL 2016
11.2 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown below:
Figure 38. No Pullback WQFN, Single Row Reference Diagram
Table 10. No Pullback WQFN Stencil Aperture Summary for DS90UB913A-Q1
DEVICE
DS90UB913A-Q1
PIN
COUNT
MKT DWG
PCB I/O PAD
SIZE (mm)
PCB
PITCH
(mm)
32
RTV
0.25 x 0.6
0.5
PCB DAP
SIZE(mm)
3.1 x 3.1
STENCIL I/O
APERTURE
(mm)
0.25 x 0.7
STENCIL
DAP
APERTURE
(mm)
1.4 x 1.4
NUMBER OF
DAP
APERTURE
OPENINGS
4
GAP
BETWEEN
DAP
APERTURE
(Dim A mm)
0.2
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