CD00161566 Datasheet, PDF (93/105 Pages) STMicroelectronics – nullMedium-density performance line ARM-based 32-bit MCU

STM32F103x8, STM32F103xB
Package characteristics
6.2
6.2.1
Thermal characteristics
The maximum chip junction temperature (T_Jmax) must never exceed the values given in
Table 9: General operating conditions on page 38.
The maximum chip-junction temperature, T_J max, in degrees Celsius, may be calculated
using the following equation:
T_J max = T_A max + (P_D max × _JA)
Where:
 T_A max is the maximum ambient temperature in C,
 _JA is the package junction-to-ambient thermal resistance, in C/W,
 P_D max is the sum of P_INT max and P_I/O max (P_D max = P_INT max + P_I/Omax),
 P_INT max is the product of I_DD and V_DD, expressed in Watts. This is the maximum chip
internal power.
P_I/O max represents the maximum power dissipation on output pins where:
P_I/O max = (V_OL × I_OL) + ((V_DD – V_OH) × I_OH),
taking into account the actual V_OL / I_OL and V_OH / I_OH of the I/Os at low and high level in the
application.
Table 59. Package thermal characteristics
Symbol
Parameter
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFBGA100 - 7 × 7 mm /0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
_{JA Thermal resistance junction-ambient}
TFBGA64 - 5 × 5 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
UFQFPN 48 - 7 × 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 × 6 mm / 0.5 mm pitch
Value
44
46
59
45
65
55
32
18
Unit
°C/W
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
DocID13587 Rev 16
93/105
104