CD00161566 Datasheet, PDF (100/105 Pages) STMicroelectronics – nullMedium-density performance line ARM-based 32-bit MCU

Revision history
STM32F103x8, STM32F103xB
Table 61. Document revision history (continued)
Date
Revision
Changes
14-Mar-2008
Figure 2: Clock tree on page 12 added.
Maximum T_J value given in Table 8: Thermal characteristics on page 38.
CRC feature added (see CRC (cyclic redundancy check) calculation unit
on page 9 and Figure 11: Memory map on page 34 for address).
I_DD modified in Table 16: Typical and maximum current consumptions in
Stop and Standby modes.
ACC_HSI modified in Table 24: HSI oscillator characteristics on page 55,
note 2 removed.
P_D, T_A and T_J added, t_prog values modified and t_prog description clarified
in Table 28: Flash memory characteristics on page 57.
t_RET modified in Table 29: Flash memory endurance and data retention.
5
V_NF(NRST) unit corrected in Table 38: NRST pin characteristics on
page 68.
Table 42: SPI characteristics on page 72 modified.
I_VREF added to Table 46: ADC characteristics on page 76.
Table 48: ADC accuracy - limited test conditions added. Table 49: ADC
accuracy modified.
LQFP100 package specifications updated (see Section 6: Package
characteristics on page 81).
Recommended LQFP100, LQFP 64, LQFP48 and VFQFPN36 footprints
added (see Figure 48, Figure 51, Figure 55 and Figure 42).
Section 6.2: Thermal characteristics on page 93 modified, Section 6.2.1
and Section 6.2.2 added.
Appendix A: Important notes on page 81 removed.
21-Mar-2008
Small text changes. Figure 11: Memory map clarified.
In Table 29: Flash memory endurance and data retention:
– N_END tested over the whole temperature range
6
– cycling conditions specified for t_RET
– t_RET min modified at T_A = 55 °C
V₂₅, Avg_Slope and T_L modified in Table 50: TS characteristics.
CRC feature removed.
CRC feature added back. Small text changes. Section 1: Introduction
modified. Section 2.2: Full compatibility throughout the family added.
I_DD at T_A max = 105 °C added to Table 16: Typical and maximum current
consumptions in Stop and Standby modes on page 45.
I_{DD_VBAT} removed from Table 21: Typical current consumption in
Standby mode on page 47.
Values added to Table 41: SCL frequency (fPCLK1= 36 MHz.,VDD_I2C
22-May-2008
7
= 3.3 V) on page 71.
Figure 33: SPI timing diagram - slave mode and CPHA = 0 on page 73
modified. Equation 1 corrected.
t_RET at T_A = 105 °C modified in Table 29: Flash memory endurance and
data retention on page 58.
V_USB added to Table 44: USB DC electrical characteristics on page 75.
Figure 56: LQFP100 PD max vs. TA on page 95 modified.
Axx option added to Table 60: Ordering information scheme on page 96.
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