CD00161566 Datasheet, PDF (79/105 Pages) STMicroelectronics – nullMedium-density performance line ARM-based 32-bit MCU

STM32F103x8, STM32F103xB
Electrical characteristics
Figure 38. Typical connection diagram using the ADC
RAIN(1)
AINx
VAIN
Cp_arasitic
VDD
VT
0.6 V
VT
0.6 V
IL±1 µA
STM32F103xx
Sample and hold ADC
converter
RADC(1)
12-bit
converter
CADC(1)
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1. Refer to Table 46 for the values of R_AIN, R_ADC and C_ADC.
2.
Cpa_{pdaracsaitpicarceitparnecseen(rtsouthgehlcya7papcFit)a.} nAcheigohf
this, f_ADC should be reduced.
the PCB
C_parasitic
(dependent on soldering and PCB layout quality) plus the
value will downgrade conversion accuracy. To remedy
General PCB design guidelines
Power supply decoupling should be performed as shown in Figure 39 or Figure 40,
depending on whether V_REF+ is connected to V_DDA or not. The 10 nF capacitors should be
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 39. Power supply and reference decoupling (V_REF+ not connected to V_DDA)
STM32F103xx
V_REF+
(see note 1)
1 µF // 10 nF
1 µF // 10 nF
V_DDA
V_SSA /V_REF–
(see note 1)
1. V_REF+ and V_REF– inputs are available only on 100-pin packages.
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