CD00161566 Datasheet, PDF (88/105 Pages) STMicroelectronics – nullMedium-density performance line ARM-based 32-bit MCU

Package characteristics
STM32F103x8, STM32F103xB
Figure 49. UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch,
package outline
Z Seating plane
ddd Z
A4 _{A3 A2}
A1 A
E1
e
F
A1 ball A1 ball
X
identifier index area
E
A
F
D1
D
e
Y
M
12
1
BOTTOM VIEW
Øb (100 balls)
Ø eee M Z Y X
Ø fff M Z
1. Drawing is not to scale.
TOP VIEW
A0C2_ME_V2
Table 55. UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package
mechanical data
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
A
0.460
0.530
0.600
0.0181
0.0209
0.0236
A1
0.050
0.080
0.110
0.0020
0.0031
0.0043
A2
0.400
0.450
0.500
0.0157
0.0177
0.0197
A3
0.080
0.130
0.180
0.0031
0.0051
0.0071
A4
0.270
0.320
0.370
0.0106
0.0126
0.0146
b
0.200
0.250
0.300
0.0079
0.0098
0.0118
D
6.950
7.000
7.050
0.2736
0.2756
0.2776
D1
5.450
5.500
5.550
0.2146
0.2165
0.2185
E
6.950
7.000
7.050
0.2736
0.2756
0.2776
E1
5.450
5.500
5.550
0.2146
0.2165
0.2185
e
0.500
0.0197
F
0.700
0.750
0.800
0.0276
0.0295
0.0315
ddd
0.100
0.0039
eee
0.150
0.0059
fff
0.050
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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