CD00161566 Datasheet, PDF (90/105 Pages) STMicroelectronics – nullMedium-density performance line ARM-based 32-bit MCU

Package characteristics
STM32F103x8, STM32F103xB
Figure 52. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
Z Seating plane
ddd Z
A4 _A2
A1 A
E1
e
F
A1 ball A1 ball
X
identifier index area
E
90/105
A
F
D1
D
e
H
Y
8
1
BOTTOM VIEW
1. Drawing is not to scale.
Øb (64 balls)
Ø eee M Z Y X
Ø fff M Z
TOP VIEW
R8_ME_V3
Table 57. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
Symbol
millimeters
Min
Typ
Max
inches⁽¹⁾
Min
Typ
Max
A
-
-
1.200
-
A1
0.150
-
-
0.0059
A2
-
0.200
-
-
A4
-
-
0.600
-
b
0.250
0.300
0.350
0.0098
D
4.850
5.000
5.150
0.1909
D1
-
3.500
-
-
E
4.850
5.000
5.150
0.1909
E1
-
3.500
-
-
e
-
0.500
-
-
F
-
0.750
-
-
ddd
-
-
0.080
-
eee
-
-
0.150
-
fff
-
-
0.050
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
-
-
0.0079
-
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
-
-
-
0.0472
-
-
0.0236
0.0138
0.2028
-
0.2028
-
-
-
0.0031
0.0059
0.0020
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